Packaging And Embedded Electronics For The Next Generation by Michael J Sampson, Paperback | Indigo Chapters
Packaging And Embedded Electronics For The Next Generation by Michael J Sampson, Paperback | Indigo Chapters

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Packaging And Embedded Electronics For The Next Generation by Michael J Sampson, Paperback | Indigo Chapters

From Michael J Sampson

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Size: 0.05 x 9.69 x 0.14

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This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities. | Packaging And Embedded Electronics For The Next Generation by Michael J Sampson, Paperback | Indigo Chapters

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